The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 1981
Filed:
May. 08, 1979
Seishi Yajima, Higashi, JP;
Masaaki Hamano, Higashi, JP;
Yoshio Hasegawa, Higashi, JP;
Kimiyuki Kamino, Chofu, JP;
Takehiro Yamane, Sakura, JP;
Mitsubishi Seiko Kabushiki Kaisha, Tokyo, JP;
The Foundation: The Research Institute for Special Inorganic Materials, Ibaragi, JP;
Abstract
This invention relates to a heat-resistant composite magnet comprising 2 to 30% by weight of an organic-inorganic compound binder containing boron and silicon and 70 to 98% by weight of the powder of one or more permanent magnets. This invention further relates to a method for producing a heat-resistant composite magnet, which comprises the steps of (a) adding the powder of one or more permanent magnets to a solution of an organic-inorganic compound binder containing boron and silicon dissolved in an organic solvent; (b) evaporating said solvent; (c) molding the resultant permanent magnet powder covered with said binder under a pressure of 0.1 to 5 tons/cm.sup.2 in the presence or in the absence of a magnetic field of 12,000-5,000 oersted, the molded product being heated at 200.degree.-450.degree. C. during the molding or after the molding; and (d) cooling the molded product. This invention still further relates to a method for producing a heat-resistant composite magnet, which comprises the steps of (a) molding the powder of one or more permanent magnet at room temperature under a pressure of 0.1 to 5 tons/cm.sup.2 in the presence or in the absence of a magnetic field of 12,000-5,000 oersteds; (b) dipping the molded product in a solution of an organic-inorganic compound binder containing boron and silicon; (c) drying the dipped product; (d) heating the dried product at 200.degree.-450.degree. C.; and (e) cooling the heated product.