The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 1981
Filed:
Jan. 21, 1980
Mohanlal S Mansuria, Wappingers Falls, NY (US);
Carl D Ostergren, Montgomery, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A gas encapsulated cooling module wherein at least one semiconductor chip to be cooled is supported on a substrate portion of the module. The provision of thin leaf shaped members each having a relatively long thin planar surface in thermal contact with a planar surface of the chip to be cooled, said thin leaf shaped members each being contained within a module cover, each of said thin leaf shaped members being spring biased in thermal contact with said planar surface of said chip, whereby the relatively long thin planar surface of each thin leaf shaped member is maintained in intimate thermal contact with the planar surface of the chip.