The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 1981

Filed:

Feb. 19, 1980
Applicant:
Inventor:

David L Taylor, Melbourne, FL (US);

Assignee:

Harris Corporation, Melbourne, FL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
148174 ; 2957 / ; 29578 ; 29580 ; 148175 ; 148187 ; 156647 ; 156649 ; 156657 ; 156662 ; 357 51 ; 357 55 ; 357 59 ; 357 49 ; 427 85 ; 427 86 ;
Abstract

A RAM cell having a pair of transistors formed in two adjacent wells laterally separated from each other and surrounded laterally by a common doped polycrystalline semiconductor moat. Dielectrical insulation separate the wells from the moat. The moat is discontinuous, forming thereby a pair of resistors connected together at one end and disconnected at the discontinuity. Surface contacts bridge adjacent areas of the well and the moat which are of the same conductivity type whereby the moat forms the load resistor for the transistor. Each transistor includes a second emitter. First level interconnects include a first interconnect interconnecting an emitter from each transistor, a second interconnect parallel to the first contacting the connected end of the moat resistors, a pair of interconnects each interconnecting the bridge contact of one transistor to the base of the other, and a pair of contacts for the other emitter regions. Second level interconnects include a pair of parallel interconnects connected to a respective emitter contact and orthogonal to the first interconnect. A method of fabrication is also described.


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