The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 1981
Filed:
Jun. 18, 1979
Mario E Ecker, Poughkeepsie, NY (US);
Leonard T Olson, Jericho, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Disclosed is a packaging structure wherein one or more integrated circuit semiconductor chips are mounted on membrane-like insulating members. The membrane-like members provide multilevel wiring and interconnection between the chip or chips and a secondary wiring structure. The packaging structure includes a module protective cap (preferably metal) and resilient means supported by said secondary wiring structure. The resilient means physically biases the semiconductor chip or chips against the module protective cap and also accommodate induced chip motion and variation. The packaging structure provides enhanced thermal, mechanical and electrical characteristics.