The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 1981

Filed:

Jun. 29, 1979
Applicant:
Inventors:

Allan S Cole, Boca Raton, FL (US);

Omkarnath R Gupta, Boca Raton, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 81 ; 357 79 ; 357 75 ; 165 / ;
Abstract

A multi-chip module is provided having one or more cylinders formed in the module cap, each centered over the middle chip of a group of chips. Cooling fins are attached to and extend from each of the cylinders. A heat conductive piston is located in each of the cylinders forming a small interface between the piston and the cylinders and the piston and the middle chip. The heat conductive piston is spring loaded against the chips. A heat conductive conformal surface flange extends radially from the outer end of each of the pistons so as to have portions thereof contacting adjacent chips in the group of chips, thereby providing parallel conduction cooling from the adjacent chips to the central heat conductive piston. Heat conductive spring means are included between the module caps and the flange for providing a seating force of the flange against the chips and providing an additional heat transfer path from the chip.


Find Patent Forward Citations

Loading…