The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 1981
Filed:
Sep. 25, 1979
Applicant:
Inventors:
Hiroshi Yui, Yotsukaichi, JP;
Yoshihiro Sobajima, Yotsukaichi, JP;
Ryoichi Ichikawa, Yotsukaichi, JP;
Shigekazu Ema, Yotsukaichi, JP;
Assignee:
Mitsubishi Petrochemical Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B29F / ;
U.S. Cl.
CPC ...
26432812 ;
Abstract
A method for molding a resin composition comprising a polyolefin and an inorganic filler to form a thin molded article, which comprises shooting said resin composition into a mold at such a high speed that its flow rate at the gate portion of the mold is at least 100 meters per second, thereby reducing the occurrence of short shots and the occurrence of mold flashing and making possible molding within a shorter period of time.