The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 1981

Filed:

Jun. 25, 1979
Applicant:
Inventors:

Werner Kuhnel, Neunkirchen-Schoneshof, DE;

Karl-Gunter Scharf, Troisdorf-Spich, DE;

Paul Spielau, Troisdorf-Eschmar, DE;

Richard Weiss, Troisdorf, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K / ;
U.S. Cl.
CPC ...
260 4215 ; 260 4249 ;
Abstract

A process for preventing separation of fillers and other dispersed additives from thermoplastic molding compositions during extrusion, calendering or like processing, along metallic contact surfaces of a processing unit, involves admixing a silane additive to a portion of a thermoplastic molding composition containing a thermoplastic molding resin and at least one filler or other dispersed additive that tends to separate out from the molding composition during the processing, processing the portion of thermoplastic molding composition in a processing unit, measuring the electrical energy applied to the processing unit during processing per kilogram of molding composition per unit time, determining if the electrical energy applied has been increased by the addition of the silane additive as compared to the electrical energy required per kilogram of molding composition per unit time for processing another portion of the thermoplastic molding composition free of the silane additive and thereafter adding an effective amount of the silane additive determined to be capable of increasing the applied electrical energy required to process the molding composition by at least 20% with the thermoplastic molding composition and processing the resulting thermoplastic molding composition in the processing unit. Among the silane additives disclosed as being suitable for this process are .beta.-chloroethyl triethoxysilane and vinyl trialkoxysilanes containing alkoxy groups having from 1 to 6 carbon atoms.


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