The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 1981
Filed:
Aug. 30, 1978
Sekisui Kagaku Kogyo Kabushiki Kaisha, Osaka, JP;
Abstract
A pipe joint of a reinforced resin having a structure in which the wall of at least a socket portion consists of an inside surface layer composed of a cured product of a reinforced resin molding material, an outside surface layer composed of a cured product of a reinforced resin molding material, and an interlayer between these layers composed of a cured product of a resin mortar. The above pipe joint can be molded by (1) forming an uncured inside surface layer composed of a resin-impregnated reinforced molding material on the peripheral surface of a core mold; (2) coating a resin mortar on the inner surface of a split mold and molding the surface of the coated resin mortar by a former having a contour substantially corresponding with that of the inside surface layer; (3) forming an incompletely cured interlayer composed of resin mortar by capping the split mold containing the molded resin mortar on the inside surface layer and removing the split mold after the curing of the resin mortar has proceeded to a certain extent; (4) forming an uncured outside surface layer composed of a resin-impregnated reinforced molding material on the peripheral surface of the incompletely cured interlayer; and (5) completing the curing of all the layers. Alternatively, a cured cylindrical structure prepared separately may be used as the inside surface layer instead of forming it in situ in the above process.