The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 1980

Filed:

Mar. 29, 1979
Applicant:
Inventor:

Yoshiaki Arai, Kyoto, JP;

Assignee:

Reiko Co., Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ; B05D / ; B05D / ; B44C / ;
U.S. Cl.
CPC ...
427264 ; 156634 ; 156655 ; 156656 ; 1566591 ; 156668 ; 427270 ; 427271 ;
Abstract

The method of making a decorated film with a metal layer in the form of a given pattern comprises the steps of forming a metal layer on at least one surface of a base sheet through the utilization of the vacuum plating technique and removing a preselected area of said metal layer from said base sheet. When a water-insoluble resin is used, the resin is printed on the metal layer to form a positive resinous pattern and then the printed material is immersed in a metal soluble aqueous solution to remove the exposed metal layer without the resinous pattern. When a water-soluble resin is used, the resin is printed on the base sheet to form a negative resinous pattern and then the metal layer is formed on the surface with the resinous pattern. The resultant material is immersed in water to dissolve the resin and simultaneously remove the metal coated on the resinous pattern together with the resin.


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