The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 1980
Filed:
Aug. 11, 1978
Applicant:
Inventors:
Koichi Niwa, Tama, JP;
Teruo Murase, Tokorozawa, JP;
Masatoshi Fujimori, Musashino, JP;
Kyohei Murakawa, Yokohama, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
29830 ; 174 685 ;
Abstract
In a method of manufacture of a multilayer ceramic board, a conductor land is formed and baked on a first substrate. A second substrate on which the wiring pattern is formed is then electrically connected to the first substrate via the land. An error in the substrate due to shrinkage at the time of sintering is thereby compensated by the conductor land. This assures the formation of a highly accurate wiring pattern on the sintered substrate surface, despite shrinkage of the ceramic during sintering of the raw sheets of ceramic.