The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 1980
Filed:
Feb. 01, 1978
Robert W Peiffer, Jackson, NJ (US);
E. I. Du Pont de Nemours and Company, Wilmington, DE (US);
Abstract
By the process of this invention, printed circuits are prepared containing an electrically conductive wiring trace from materials having adherent and non-adherent surface areas, e.g., printed circuit substrates bearing an imaged photoadhesive layer. Onto the adherent surface areas of the material are applied ductile metal or alloy particles, and any excess particles are removed from the non-adherent areas. The metallized areas are conjoined, e.g., with silicon carbide brush or rounded metal rod. The conjoined areas can be electrolessly plated, electroplated or soldered. Multilayer printed circuits can also be prepared by repeating these steps with additional layers of photoadhesive material adhered to underlying printed circuits.