The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 1980

Filed:

May. 02, 1978
Applicant:
Inventors:

Hiroshi Maruyama, Kyoto, JP;

Masashi Watanabe, Kyoto, JP;

Assignee:

Horiba, Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29F / ; G01N / ;
U.S. Cl.
CPC ...
264113 ; 2041 / ; 264127 ;
Abstract

A liquid junction for a reference electrode and a method of forming the same, in which a hydrophobic polymer support material has a liquid junction layer or portion of material therein comprised of a hydrophobic polymer in mixture with either an inactive particulate substance, an electro-chemically inactive salt, or a combination of said inactive particulate substance and said electro-chemically inactive salt. The support member and the liquid junction therein are compression formed in a mold and are heat-treated following the final compression treatment.


Find Patent Forward Citations

Loading…