The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 1980
Filed:
Jul. 17, 1978
Applicant:
Inventors:
Masayuki Osawa, Saku, JP;
Masaoki Sekine, Saku, JP;
Assignee:
TDK Electronics Company Limited, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B29F / ;
U.S. Cl.
CPC ...
2643281 ; 264334 ; 425444 ; 425556 ;
Abstract
A molding method comprises a step of fitting a movable mold to a stationary mold and filling a molten resin into a cavity formed by the mold fitting; a step of separating the movable molds; a step of releasing a molded product held by one or more push pins while shifting the push pins; a step of holding the molded product by a guide having a .]. shaped sectional view; and a step of releasing the molded product from the push pins to pass the molded product along the guide having a .]. shaped sectional view.