Four-quadrant, multiprobe-edge sensor for semiconductor wafer probing

Abstract

A four-quadrant multiprobe edge sensor system which comprises a printed circuit board having a plurality of data probes mounted thereon which include four data-detector probes particularly-positioned. The data-detector probes include a support body, and an arm supported by the body and attached thereto in an angular fashion. A probe tip in the form of a needle extends from and is attached to the arm. The probe tip includes a downwardly positioned point for contact with the surface having integrated circuits defined thereon. A force sensitive material is attached to but electrically isolated from the arm and has conductor leads extending therefrom with said force sensitive material comprising a piezoelectric material, for example. The four data-detector probes are located on the printed circuit board such that when being used for testing, the probe tips of the four data-detector probes are placed in each of the four corners of an integrated circuit chip defined on a semiconductor slice. The four-quadrant edge sensor detects the edge of the semiconductor slice regardless of the direction the slice is moving in relation to the probe head. This detection is signaled to a detection circuit which sends a signal to the multiprobe to begin indexing and reversing direction of the slice movement for testing the next chip.