The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 1980
Filed:
Dec. 18, 1978
Han J Kim, Greensburg, PA (US);
Thomas E Peters, Chelmsford, MA (US);
David Snee, Murraysville, PA (US);
GTE Products Corporation, Stamford, CT (US);
Abstract
The instant invention relates to a method of preparing an electrical contact from sub-micron size silver and less than two micron size cadmium oxide particles with the contact having finally dispersed particles of cadmium oxide within grains of silver. In the instant invention the particles of silver and cadmium oxide are intimately blended together and subjected to a reducing atmosphere at a temperature of from 321.degree. C. to 550.degree. C. to reduce the cadmium oxide and form an alloy powder of cadmium and silver. The alloy formed is held at an elevated temperature following reducing and then oxidized at a temperature of from 321.degree. C. to 550.degree. C. to precipitate a dispersion of cadmium oxide within grains of silver and form a silver-cadmium oxide alloy powder. In an alternative embodiment an alloy powder of cadmium and silver already prepared from sub-micron size particles of silver and less than two micron size particles of cadmium oxide is heated to a temperature of from 321.degree. C. to 550.degree. C. in an inert atmosphere. The inert atmosphere is then changed to an oxidizing atmosphere at that temperature to precipitate the dispersion of cadmium oxide within the grains of silver. The material as prepared by both embodiments is then formed into an electrical contact.