The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 1980
Filed:
Sep. 28, 1978
Kiyoshi Negishi, Asaka, JP;
Katsuhiko Miyata, Omiya, JP;
Asahi Kogaku Kogyo Kabushiki Kaisha, Tokyo, JP;
Abstract
A multi-layer flexible printed circuit board assembly, having at least two flexible printed circuit boards with electrical conductive layers piled one on another. The conductive layers face in the same direction and a portion of the lower flexible printed circuit board is not covered with the upper flexible printed circuit board. Hence, some of the lead wires of an electronic component can be connected to the electrical conductive layer of the upper flexible printed circuit board, and the remaining lead wires can be connected to said electrical conductive layer of the lower flexible printed circuit board. The portion of the lower flexible printed circuit board which is not covered by the upper flexible printed circuit board is raised so that the surface of a copper foil layer on the upper flexible printed circuit board is substantially flush with the surface of a copper foil layer on the lower flexible printed circuit board.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile