The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 1980
Filed:
Jun. 16, 1978
Harold A Malson, Kettering, OH (US);
Harold B Honious, Dayton, OH (US);
Stanley E Moyer, Dayton, OH (US);
Edward F Janzow, Xenia, OH (US);
Monsanto Research Corporation, St. Louis, MO (US);
Abstract
The invention relates to radiation sources comprising a substrate having an electrically-conductive non-radioactive metal surface, a layer of a metal radioactive isotope of the Scandium group, which in addition to scandium, yttrium, lanthanum and actinium, includes all the lanthanide and actinide series of elements, with the actinide series usually being preferred because of the nature of the radioactive isotopes therein, particularly americium-241, curium-244, plutonium-238, californium-252 and promethium-147, and a non-radioactive bonding metal codeposited on the surface by electroplating the isotope and bonding metal from an electrolytic solution, the isotope being present in the layer in minor amount as compared to the bonding metal, and with or without a non-radioactive protective metal coating covering the isotype and bonding metal on the surface, the coating being sufficiently thin to permit radiation to pass through the coating. The invention also relates to a process for providing radiation sources comprising codepositing a layer of the metal radioactive isotope with a non-radioactive bonding metal from an electrolytic solution in which the isotope is present in minor molar amount as compared to the bonding metal such that the codeposited layer contains a minor molar amount of the isotope compared to the bonding metal by electroplating on an electrically-conductive non-radioactive metal surface of a cathode substrate, and with or without depositing a non-radioactive protective metal coating over the isotope and bonding metal on The surface, the coating being sufficiently thin to permit radiation to pass through the coating.