Semiconductor wafer polishing machine and wafer carrier therefor

Abstract

A carrier for semiconductor wafers to be polished is described, as well as mounting structure for securing the carrier within a polishing machine. The carrier is a relatively thick metal plate having on one of its faces, a sheet of material to which wafers can be adhered. An annular flange is on its opposite face to receive pressure loading from the polishing machine during the wafer polishing operation. Radially extending webs connect the annular flange with that area of the plate to distribute the pressure loading over substantially the full area of the plate opposed to the area on the opposite face on which wafers are to be adhered. An arrangement is included in the holder of the polishing machine for the carrier which applies a vacuum to the carrier to maintain the carrier selectively on the polishing machine, which arrangement releases the vacuum during the polishing operation and also enables simple intentional removal of the carrier. The carrier holder also enables the orientation of the carrier relative to the remainder of the polishing machine to be angularly tilted in such a manner that the leverage of any tangential force applied to wafers being polished is minimized.