The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 18, 1980

Filed:

Jun. 29, 1978
Applicant:
Inventors:

Richard C Chu, Poughkeepsie, NY (US);

Un-pah Hwang, Poughkeepsie, NY (US);

Robert E Simons, Poughkeepsie, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
165 79 ; 165 / ; 165 / ; 165185 ; 361387 ;
Abstract

An improved conduction cooled module of the type having at least one chip mounted on a substrate and having a housing surrounding the chips and sealed to the substrate. The housing having cylinders therein opposite the chips for containing pistons which are resiliently urged against the chip surface. Each piston has an opening extending from the top to the bottom surface and has at least one circumferential groove located in the outer wall of the piston. The opening and circumferential grooves are preloaded with a low melt point heat conductive material which is reflowed after assembly into the module to fill the interfaces formed between the piston and chip and the piston and cylinder. Grooves are located in the piston walls forming the interfaces which facilitate the flow of the molten material into the interfaces.


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