The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 11, 1980

Filed:

Sep. 12, 1978
Applicant:
Inventors:

Kunio Enomoto, Kawagoe, JP;

Uhee Kikuchi, Sayama, JP;

Masanori Kobori, Kawagoe, JP;

Suguru Kimura, Sayama, JP;

Satoru Kamiyama, Tokyo, JP;

Nobuaki Todoroki, Warabi, JP;

Jun-ichi Yasukawa, Chigasaki, JP;

Assignees:

Taikisha Ltd., Tokyo, JP;

Honda Motor Co., Ltd., Tokyo, JP;

Shinto Paint Co., Ltd., Amagasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D / ; C25D / ; C25D / ;
U.S. Cl.
CPC ...
2041 / ; 2041 / ; 2042 / ; 2043 / ;
Abstract

A method for supplying powder into a coating tank for electrophoretic powder coating comprises a first step for taking out a specified amount of plating bath of which the powder contained therein is reduced as a result of coating work, a second step in which the powder of much the same amount as the reduced amount of the powder is supplied to the plating bath taken out while the plating bath is being agitated to disperse the powder in the plating bath (the first dispersion) to form supplementary plating bath, a third step including the step for second dispersion of the powder in which the powder contained in the supplementary plating bath is further uniformly dispersed and a step for aging the supplementary plating bath with the dispersed powder, and a fourth step for supplying to the coating tank sufficiently aged supplementary plating bath which is obtained from the third step and has a high density of powder which is substantially uniformly dispersed in the supplementary plating bath, and an apparatus is one for executing that method.


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