Multi-level socket for an integrated circuit

Abstract

An integrated circuit socket adapted for use with circuits such as dual-in-line packages (DIPs) provides multilevel mounting for such integrated circuits. The socket body is formed to receive the first integrated circuit package while the second integrated circuit package is disposed above the first. Metallic contact members are disposed in holes arranged to coincide with the electrical leads subtending from each circuit. Each contact member is formed with means to receive the coincident electrical leads from the first and second circuits. Each contact member is formed to engage the socket preventing inadvertent removal of the contact member. The contact members are sufficiently long to extend through the socket and an associated printed circuit board to which they may be readily fixed by conventional means. In the one embodiment the socket is unitary and is formed with longitudinal protruding spacer members to separate it from the circuit board. In a second embodiment the socket is modular. Still a third embodiment provides an adjacent contact member allowing selective separate engagement of a lead from one of the two electronic packages.