Room-temperature curable elastic composition

Abstract

An elastic composition curable at room temperature comprising (A) a diamine of a specified structure having a molecular weight of about 5,000 to about 25,000, (B) a diepoxy compound in an amount such that the mole ratio of the epoxy groups in the diepoxy compound to the primary amino groups in diamine (A) is from 0.5 to 5.0, and (C) a mixture of (i) a diacrylic acid ester and/or a dimethacrylic acid ester and (ii) a tri- or higher polyacrylic acid and/or a tri- or higher polymethacrylic acid ester in which 5 to 90% of the acryloyl and/or methacryloyl groups are derived from the diacrylic and/or dimethacrylic acid ester, the amount of said mixture being such that the mole ratio of the sum of the acryloyl and methacryloyl groups in the mixture to the primary amino groups in diamine (A) is from 0.1 to 2.0, and as optional ingredients, at least one of (D) an inorganic filler, (E) a monoepoxy compound, (F) a curing promotor, (G) a viscosity controlling agent, (H) an organic filler, (I) an age resister, (J) a sag inhibitor, (K) an ultraviolet absorbent, and (L) an assistant sag inhibitor. Since the composition is deformable in conformity to changes in joint during the process of curing, it is useful to provide various sealing materials of good quality.