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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 4181635 B1

PDFFull Text
Date of Patent:
Jan. 01, 1980

Filed:

Feb. 17, 1978

Pressure sensitive adhesive compositions

Applicant:
Inventors:

Hideo Takamatsu, Ibaragi, JP;

Shobu Minatono, Ibaragi, JP;

Katsuyoshi Terao, Ibaragi, JP;

Junnosuke Yamauchi, Ibaragi, JP;

Assignee:

Kuraray Co., Ltd., Kurashiki, JP;

Attorney:

Oblon, Fisher, Spivak, McClelland & Maier

Primary Examiner:

Allan Lieberman

Int. Cl.
CPC ...
C08L / ; C08L / ; C08L / ; C09J / ;
U.S. Cl.
CPC ...
260-5 ; 260 / ; 260 / ; 525 92 ; 525 93 ; 525 95 ; 525 98 ; 525 99 ; 525185 ; 525214 ; 525219 ; 525222 ;
Abstract

A pressure-sensitive adhesive composition having excellent tackiness and improved thermal resistance comprises (A) a low molecular weight polyisoprene, which may be obtained by polymerizing isoprene monomer with the aid of a lithium-type catalyst, said polyisoprene having a cis-1,4 content of not less than 75%, a viscosity average molecular weight of 8,000 to 77,000 and an Mw/Mn value (Mw: weight average molecular weight; Mn: number average molecular weight) of 1.0 to 2.7 and (B) an elastomer.

Find Patent Forward Citations

Takamatsu, Hideo. (1980). Pressure sensitive adhesive compositions (U.S. Patent No. 4181635). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4181635

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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