The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 1979
Filed:
Aug. 29, 1978
Applicant:
Inventors:
Assignee:
Hitachi, Ltd., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D / ;
U.S. Cl.
CPC ...
204 / ; 106-126 ; 204 / ; 204 / ;
Abstract
A process for silver-plating, which comprises steps of preplating a substrate material in an aqueous preplating solution comprising 10.sup.-5 to 0.02 mole/l of silver and more than 0.01 mole/l of a silver complexing agent such as thiocyanic ions under non-current density, to preplate a sufficient thickness of silver to restrain or substantially prevent substitution plating, and then electroplating the preplated substrate material until a sufficient thickness by supplying an electric current to said material in an aqueous silver plating solution comprising silver ions, thiocyanic ions and a film improving agent.