The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 1979
Filed:
Feb. 07, 1978
Toyo Seikan Kaisha, Ltd., Tokyo, JP;
Abstract
A bonded can having a high hot water resistance, which consists of a metal material having both the confronting side edges bonded together by a linear polyamide adhesive through an epoxy-phenolic resin undercoating composition, wherein said epoxy-phenolic resin undercoating composition comprises 50 to 95% by weight of an epoxy resin having a number average molecular weight of 800 to 5500, which is obtained by condensation of an epihalohydrin with bisphenol A, and 5 to 50% by weight of a resol-type phenol-aldehyde resin having a number average molecular weight of 200 to 1000, which is obtained by reacting a mixed phenol comprising 65 to 98% by weight of a dihydric phenol represented by the following general formula: ##STR1## wherein R stands for a bridging group or is a direct bond, and 2 to 35% by weight of a monohydric phenol, with an aldehyde in the presence of a basic catalyst. This bonded can can resist retort sterilization conducted at 122.degree. to 135.degree. C. without substantial reduction of the peel strength of the bonded portion.