The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 1979
Filed:
May. 05, 1977
Yoshiaki Kato, Neyagawa, JP;
Akira Fushida, Suita, JP;
Yasuo Ueda, Kobe, JP;
Yasusuke Tohi, Sakai, JP;
Tatsuo Aizawa, Osaka, JP;
Mita Industrial Company Limited, Osaka, JP;
Abstract
An electrophotographic photosensitive material suitable for offset printing and lithography comprising a flexible substrate, an electroconductive back coat layer formed on one surface of the substrate, an electroconductive intermediate layer formed on the other surface of the substrate and a photoconductive layer formed on the intermediate layer, said photoconductive layer being composed of a fine powder of a photoconductor dispersed in an electrically insulating resin, wherein said intermediate layer is composed of a composition comprising (A) an acrylic resin, (B) a vinyl acetate polymer having a degree of polymerization of 100 to 1700 and (C) a resinous conducting agent, in said composition the weight ratio of acrylic resin (A)/vinyl acetate polymer (B) is in the range of 4/1 to 10/1 and the amount of the conducting agent (C) is 20 to 100 parts by weight per 100 parts by weight per 100 parts by weight of the sum of the components (A) and (B), said intermediate layer has such a multi-layer distribution structure that a combination of the vinyl acetate polymer and the acrylic resin is predominantly distributed in the surface portion falling in contact with the photoconductive layer, and the photoconductive layer is bonded to the intermediate layer through said surface portion.