The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 1979

Filed:

Dec. 13, 1977
Applicant:
Inventors:

Yoshinobu Taguchi, Tokyo, JP;

Kotaro Harigane, Tokyo, JP;

Tetsuro Ito, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P / ; B23Q / ; B21F / ;
U.S. Cl.
CPC ...
295663 ; 29715 ; 140105 ; 227 79 ;
Abstract

An apparatus for trimming and securing parallel lead electronic components inserted in a printed circuit substrate is provided. The apparatus includes a selectively rotatable driving assembly selectively displaceable towards an electronic component inserted into a printed circuit substrate, a lead bending assembly mounted on the driving assembly for bending the leads, and a cutting assembly mounted on the bending assembly for cutting the leads, the bending and cutting assemblies actuated by displacement of the driving assembly. The apparatus may include a sub-assembly for disposal of chips removed from the leads during cutting and a detection sub-assembly for detecting the presence of an inserted electronic component.


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