The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 1979
Filed:
Feb. 02, 1978
Applicant:
Inventors:
Kunio Aomura, Tokyo, JP;
Kenji Okada, Tokyo, JP;
Assignee:
Nippon Electric Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 68 ; 357 59 ; 357 71 ;
Abstract
In a semiconductor integrated circuit, an insulating film is formed on a major surface of the substrate. An elongated wiring layer including a polycrystalline silicon layer is formed on the insulating layer. At least one metallic area is formed over the wiring layer except at the ends of the wiring layer.