The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 1979
Filed:
Feb. 13, 1978
Robert W Peiffer, Jackson, NJ (US);
E. I. Du Pont de Nemours and Company, Wilmington, DE (US);
Abstract
By the process of this invention, two layer printed circuits having conductive interconnections are prepared by applying a photoadhesive layer to a substrate bearing an electrically conductive circuit pattern, exposing the photoadhesive layer to a circuit image related to the circuit pattern to produce adherent circuit image areas having segments thereof, e.g., pad areas, overlying segments of the electrically conductive circuit pattern, applying metal, alloy or plating catalyst powder, e.g., copper, to the adherent image areas, exposing the metallized or catalytic circuit pattern to an image of the overlying segments of the previous circuit patterns, removing the overlying segment areas of the photoadhesive layer with a suitable solvent, and treating the metallized surface by plating, e.g., electrolessly plating, or by soldering. Multilayer printed circuits can also be prepared by repeating these steps with additional layers of photoadhesive material adhered to underlying printed circuits.