The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 15, 1979

Filed:

Apr. 27, 1978
Applicant:
Inventors:

Mitsuo Inui, Yokohama, JP;

Geoge Murota, Tokyo, JP;

Akira Kasai, Fujisawa, JP;

Naonori Shiina, Tokyo, JP;

Yoshikazu Kashiwa, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D / ;
U.S. Cl.
CPC ...
264 455 ; 264 461 ; 264 53 ; 264171 ; 264D / ; 264D / ; 425325 ; 4258 / ; 428213 ; 428315 ; 428322 ; 521 51 ;
Abstract

A tough board of thermoplastic resin foam provided with skin layers on both surfaces thereof and formed of large cells elongated in the direction of the thickness of said board, wherein an intermediate high density layer thicker than 0.1mm lies substantially halfway between the upper and lower surfaces of said board. The board is formed by extruding thermoplastic resin containing dissolved foaming agent as a sheet, cooling the upper and lower surfaces rapidly to form solid skin layers and then slowly cooling while allowing controlled expansion thereof between expansion restricting members.


Find Patent Forward Citations

Inui, Mitsuo. (1979). Method of manufacturing a tough board of thermoplastic resin foam having (U.S. Patent No. 4154785). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4154785

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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