The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 1979
Filed:
Nov. 03, 1977
Applicant:
Inventors:
Akifumi Hayakawa, Tokyo, JP;
Akira Aiba, Kawasaki, JP;
Eiki Orihara, Tokyo, JP;
Kiyoshi Fukushima, Fujisawa, JP;
Assignee:
Nippon Steel Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29D / ;
U.S. Cl.
CPC ...
249 82 ; 249141 ; 425546 ; 4258 / ;
Abstract
Mould assembly for foam moulding of plastic materials, which comprises stationary and movable dies and an auxiliary die plate device between the stationary and movable dies. A gas passage is formed for introducing pressurized inert gas into the mould cavity. The auxiliary die device comprises separated inner and outer auxiliary dies both being spring biased toward the stationary die. O-ring seals are disposed between the opposite surfaces of the outer auxiliary die and the stationary and movable dies.