The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 1979

Filed:

Oct. 13, 1977
Applicant:
Inventors:

Dietmar Schnepf, Esslingen, DE;

Klaus Reindl, Pfullingen, DE;

Heiko Gruner, Gerlingen, DE;

Friedrich Vogel, Reutlingen, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 71 ; 357 65 ; 357 67 ; 357 59 ;
Abstract

A pure aluminum outer layer is provided to facilitate bonding with aluminum bonding wires having a diameter of 50 .mu.m or greater without formation of troublesome slivers upon bonding. Beneath that a copper-bearing aluminum layer with 1 to 4% copper content is provided. A third layer beneath the copper-bearing layer containing up to 1% silicon can be added below the copper-bearing layer to promote adhesion at contact window edges.


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