The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 1979

Filed:

Apr. 07, 1977
Applicant:
Inventors:

Michael R Zona, McKeesport, PA (US);

Charles R Ruffing, Edgewood, PA (US);

Paul S Johrde, Franklin, PA (US);

Assignee:

Westinghouse Electric Corp., Pittsburgh, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K / ; B29C / ;
U.S. Cl.
CPC ...
310 71 ; 29605 ; 264219 ; 264272 ; 264299 ; 310 43 ; 310260 ;
Abstract

The terminal portion of a winding end turn conductor which projects from the core member of a dynamoelectric machine is encapsulated in an epoxy potting compound by means of a casting assembly which comprises a detachable conformable pad, a plastic sleeve mold, and a portable vise. The conformable pad is fitted about the terminal portion of the conductor to provide a temporary barrier to axial flow of the epoxy compound during casting. The plastic sleeve is disposed around the terminal portion in a spaced relationship therewith and in an abutting relation with the pad to provide a barrier to the radial flow of the epoxy compound during casting. Clamping means such as a portable vise is fitted about the conformable pad and is tightened to establish a compressive union at the interface of the conformable pad and the terminal portion of the conductor to prevent leakage. A pair of spring members hold the sleeve in abutting engagement with the surface of the conformable pad during the casting process. In a preferred embodiment, a sealing compound is applied to the interface of the pad and the sleeve and also between the pad and the terminal portion of the conductor to prevent leakage. After the epoxy compound has cured, the clamping means and detachable conformable pad are removed from the assembly and can be reused to encapsulate other conductors.


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