The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 1979
Filed:
Oct. 20, 1977
Applicant:
Inventors:
Yoshiyuki Sugawa, Itami, JP;
Yoshiro Shikano, Amagasaki, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 74 ; 357 72 ; 357 79 ; 357 81 ;
Abstract
A semiconductor element is disposed within a hollow cylindrical, electrically insulating member. The member has each of opposite open ends closed with a respective electrode of the element and a piece of thin sheet metal to form an annular space on either side of the semiconductor element. A silicone rubber layer is attached to that surface of the metallic piece facing the semiconductor element, and a high thermally resisting ceramic annulus is buried in the layer.
Sugawa, Yoshiyuki. (1979). Flat package semiconductor device having high explosion preventing (U.S. Patent No. 4150394). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4150394
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile