The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 1979

Filed:

May. 31, 1977
Applicant:
Inventors:

Paul W Juneau, Jr, Norristown, PA (US);

Martin M West, Philadelphia, PA (US);

Assignee:

General Electric Company, Philadelphia, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K / ; C08K / ; C08K / ; C08K / ;
U.S. Cl.
CPC ...
260 / ; 260 / ; 260 / ; 260 / ; 260 / ; 260 / ; 260 / ; 260 / ; 260 / ; 260 / ; 260 / ; 260 / ; 260 4222 ; 423297 ; 423298 ;
Abstract

A bimetallic adhesive for surface bonding and for controlled release applications that is non-explosive and which also provides improved shock, moisture, temperature and spark resistance characteristics. The bimetallic adhesive comprises a resinous adhesive binder and a bimetallic mixture, which consists of boron and titanium powders. The bimetallic adhesive mixture provides a controlled release function to separate a bonded surface when heated to a temperature above 600.degree. C., thereby causing the mixture to react exothermically to effect complete deflagration of the mixture.


Find Patent Forward Citations

Juneau, Jr, Paul. (1979). Bimetallic adhesive mixture for bonding and release applications (U.S. Patent No. 4145328). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4145328

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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