The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 1979

Filed:

Jul. 28, 1977
Applicant:
Inventors:

Hideo Shinmi, Ichihara, JP;

Tsuneo Hanada, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ;
U.S. Cl.
CPC ...
260 / ; 260825 ; 264331 ; 264329 ; 528 18 ; 528 31 ; 528 33 ; 528 36 ; 528 43 ; 260 / ; 260 / ; 260 / ;
Abstract

An improved thermosetting silicone resin molding composition characterized by consisting essentially of 100 parts by weight of organopolysiloxane resin having organic radical: Si ratio of 1.0:1 to 1.7:1 and containing at least 0.2% by weight of silicon-bonded hydroxyl groups, organohydrogenpolysiloxane containing at least one silicon bonded hydrogen atom in each molecule thereof, said organohydrogenpolysiloxane being in such an amount that the number of the hydrogen atoms per hydroxyl group in said organopolysiloxane is between 0.001 and 0.30, 0.01 to 15 parts by weight of organotin oxide, and 50 to 700 parts by weight of an inorganic filler.


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