The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 1979

Filed:

Jul. 08, 1977
Applicant:
Inventors:

Mituharu Morozumi, Yokohama, JP;

Masataka Arai, Kanagawa, JP;

Shigeru Iseki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B01J / ;
U.S. Cl.
CPC ...
264117 ; 264122 ; 264127 ;
Abstract

Finely ground polytetrafluoroethylene molding powder with or without a filler is subjected to high speed agitation in the presence of a medium consisting essentially of water and a hydrophobic organic liquid at a ratio of 0.5 to 1 liter per 1 Kg of the resin to agglomerate it. Hydrophobic organic liquids mean organic liquid which dissolve less than 15 wt. % in water at the temperature of agglomeration. The volumetric ratio of the organic liquid to water is in a range of 2 to 1/2. The agglomerated product having narrow particle size distribution and high bulk density and free flowing property can be obtained by the agitation for short time.


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