The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 1979
Filed:
Jan. 27, 1978
Applicant:
Inventors:
Walter R Holbrook, Reading, PA (US);
Louis A Koszi, Scotch Plains, NJ (US);
Assignee:
Bell Telephone Laboratories, Incorporated, Murray Hill, NJ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ; H01L / ;
U.S. Cl.
CPC ...
228110 ; 228123 ; 228253 ; 156 731 ; 156233 ;
Abstract
Disclosed is a method of bonding microelectronic chips to bonding surfaces utilizing thin, soft bonding material preforms. The bonding material, such as indium, is formed on a carrier strip. A portion of the material is transferred from the strip by bringing it in contact with the bonding surface and supplying pressure to the strip. The chip may then be bonded to the coated surface.