The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 1979

Filed:

Jan. 09, 1978
Applicant:
Inventor:

Ming S Shum, Des Plaines, IL (US);

Assignee:

UOP Inc., Des Plaines, IL (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23P / ;
U.S. Cl.
CPC ...
291574 ; 29459 ; 165133 ; 138144 ; 138145 ; 138146 ; 427178 ; 427202 ; 427227 ; 138D / ; 427228 ; 427247 ; 427244 ; 427373 ; 427276 ; 427257 ;
Abstract

The invention relates to improving the heat transfer properties in boiling liquids of tubes and other surfaces by applying a non-conductive very porous reticulated organic foam layer in contact with the tube surface, and then electroplating a metal coating on exposed portions of the tube to build up a matrix of metal through the porous portions of the foam layer. Preferably, the tube is copper and the plating consists of an electroplated layer of copper. The foam is preferably in the form of a thin tape which is spirally wound about the tube. Pyrolyzation of the foam after plating provides a network of interconnected pores in the metal matrix which improves the heat transfer performance of the tube. The plated tube may also be swaged.


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