The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 1979
Filed:
Apr. 27, 1977
Yasuyuki Tanaka, Isuchiura, JP;
Kazuo Nakajima, Inashiki, JP;
Nippon Mektron Kabushiki Kaisha, Tokyo, JP;
Abstract
A method of manufacturing a die for embossing a desired circuit pattern of a metal foil onto a substrate comprises steps of forming, on the work surface of die material, a first circuit-coating pattern corresponding to the contour of the desired circuit pattern and a second circuit-coating pattern large enough to cover the first circuit-coating pattern and larger than the desired circuit pattern. The die material surface uncovered by the second circuit-coating pattern is partly etched away to leave a grooving for receiving the embossed metal foil. Then, the second circuit-coating pattern is stripped away, and the uncovered metal portion surrounded by the first circuit-coating pattern is suitably removed, and finally the first coating pattern is stripped away.