The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 1979
Filed:
Apr. 12, 1978
Franz Hofer, Eindhoven, NL;
Gustaaf H VAN DER Hoorn, Eindhoven, NL;
U.S. Philips Corporation, New York, NY (US);
Abstract
A method of manufacturing an elementary slice provided with a microcircuit and having terminal connections in the form of metallic bumps which ensure the connection of the microcircuit to external circuitry. A major slice is provided in which a number of elementary slices are formed which adjoin each other along future severing lines. Lands are provided on which to grow metallic bumps. In order to be able to electrolytically grow the metallic bumps on the lands, the latter are series-connected together and to a voltage source by conductive strips which extend in a zig-zag manner over the severing lines. After the growth process the electric connections between the lands are automatically interrupted when the slice is severed into elementary slices. The most important application of the invention lies in the field of manufacturing elementary slices with bubble domain handling structures.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile