The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 1979
Filed:
May. 09, 1977
Patricia A Antonoplos, Houston, TX (US);
William J Heilman, Houston, TX (US);
Gulf Oil Corporation, Pittsburgh, PA (US);
Abstract
The applicants have provided novel heat curable resin compositions consisting predominately of a chemical compound having the structure of Formula A shown in FIG. 1 of the drawings. A desirable characteristic of the novel resin compositions of the invention is that they have a high solubility in selected solvents such as N-methyl-2-pyrrolidone (NMP) so that resin solutions containing at least 30 weight % resin solids at ambient temperature can be prepared. Glass fabric laminates having a high loading of resin are easily prepared from such solutions. Typically, high solids solutions of the compounds of Formula A are prepared by a three-step process. A solution containing at least 17 weight % of 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride (BTDA) in N-methyl-2-pyrrolidone (NMP) is prepared by heating the BTDA and NMP to a temperature of at least 150.degree. C with stirring. The solution then is cooled to a temperature of about 60.degree. C and substantially 0.5 molar portion (based on 1 molar portion of BTDA) of a bis(aminophenoxy) benzene (APB) is added thereto to prepare a high solids solution of a compound having the structure of Formula B shown in FIG. 1. Subsequently, while maintaining this solution at a temperature of about 60.degree. C, substantially 1.0 molar portion of a 3-aminophenylacetylene (APA) is added thereto to prepare a high solids solution of a compound having the structure of Formula A.