The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 1978

Filed:

Dec. 20, 1976
Applicant:
Inventors:

Erich Schunck, Hochheim, Main, DE;

Heinz Schmelzer, Rummelsheim, DE;

Richard Sattelmeyer, Schlangenbad, Georgenborn, DE;

Assignee:

Hoechst Aktiengesellschaft, Frankfurt am Main, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22B / ;
U.S. Cl.
CPC ...
428261 ; 260 / ; 260 / ; 260 / ; 260 / ; 260 / ; 260846 ; 428286 ; 428411 ; 428460 ; 428462 ; 428473 ; 428494 ; 428518 ; 428519 ; 428520 ;
Abstract

An adhesive composition based on I. 100 parts by weight of a block copolymer with at least two polymer blocks (A) and at least one polymer block (B), wherein the polymer blocks (A) comprise non-elastomeric blocks with an average molecular weight of from 2000 to 125,000 derived from an aromatic hydrocarbon substituted by one of the groups consisting of the members monoalkenyl and monoalkylidene and wherein not more than 25% of the original double bonds are hydrogenated, and polymer block (B) is an elastomeric block with an average molecular weight of from 10,000 to 250,000 derived from a conjugated diene, wherein at least 75% of the aliphatic unsaturated bonds are hydrogenated; Ii. 10 to 200 parts by weight of at least one cohesion-increasing resin selected from the group consisting of an alkylphenol resin, an arylphenol resin, a phenol-colophony-adduct and a rosin-modified phenol resin; The components dissolved in at least one solvent and a process of bonding one substrate to another substrate which comprises applying to the surface of either substrate an adhesive composition as claimed in claim 1 and placing the surfaces to be bonded together.


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