The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 1978
Filed:
Jul. 06, 1977
Ko Soeno, Hitachi, JP;
Tomio Iizuka, Ibaraki, JP;
Toshio Doi, Hitachi, JP;
Hisashi Ando, Hitachi, JP;
Testuo Oyama, Takahagi, JP;
Hiroshi Sakamoto, Hitachi, JP;
Akira Misumi, Mobara, JP;
Hitachi, Ltd., , JP;
Abstract
The present cathode for cathode ray tube of directly heating type is characterized by comprising a cathode substrate body having two leg pieces extended in the same direction and a flat part connected to one end of each leg piece, prepared by shaping a flat metal plate of nickel- or cobalt-based alloy, a bonding layer having an uneven surface prepared by diffusion bonding by heating a powder layer comprising powders of alloy or mixture of nickel and cobalt formed on the flat part, to which a thermionic emission layer is to be bonded, and the thermionic emission layer, and has a very small deformation when used and a longer life. A cathode with much less deformation and much longer life can be obtained by using a cathode substrate body prepared from a flat metal plate provided with a thinner metal layer of at least one of nickel and cobalt on its surface than the flat metal plate by diffusion bonding. A cathode with much less deformation after the service for a long period and much longer life is obtained by using a cathode substrate body prepared from a flat metal plate provided with a metal layer of at least one of nickel and cobalt having a smaller thickness on its surface than that of the flat metal plate by diffusion bonding, and then applying a plastic working to the flat metal plate to a desired thickness.