The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 1978

Filed:

Aug. 15, 1977
Applicant:
Inventors:

J Arthur Marceau, Seattle, WA (US);

Ralph H Firminhac, Kent, WA (US);

Yukimori Moji, Seattle, WA (US);

Assignee:

The Boeing Company, Seattle, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D / ;
U.S. Cl.
CPC ...
204 / ; 204 / ; 204 58 ; 428416 ; 428469 ;
Abstract

Environmentally stable bond joints of aluminum metal and aluminum alloys in adhesively joined structures are formed by utilizing a prebonding anodization of the aluminum surfaces in a phosphoric acid electrolyte using an electrolyte bath temperature of 60.degree. to 85.degree. F. The anodized surface is then removed from the electrolyte bath and washed free of electrolyte within from one half to two and one half minutes from cessation of anodizing current, dried and coated with adhesive resin. The anodized aluminum metal surfaces are then juxtaposed with an adhesive resin and bonded together under pressure and heat to cure the adhesive resin. The resulting structure is resistant to failure of the bond joints on exposure to moist atmospheric conditions. The surface preparation provides a porous hydration resistant aluminum oxide surface which minimizes adhesive failure to the oxide-adhesive interface under aqeuous exposure. Alloys containing copper and other constituents may be successfully anodized and bonded by this process.


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