The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 1978
Filed:
Nov. 07, 1977
Thomas C Babcock, Endicott, NY (US);
Theron LaR Ellis, Vestal, NY (US);
Henry C Majka, Endwell, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Subsequent to the additive plating of copper circuitry on a substrate and prior to further steps such as lamination to form a multilayer printed circuit board, a sequence of etching and cleaning steps are used to improve the lamination strength of the additively plated copper. The circuitized substrate is dipped in an etchant bath and then baked at an elevated temperature for 2-4 hours. Following this the circuitized substrate is washed with an organic cleaner, water rinsed and air dried. Thereafter a chlorite oxide layer is added to the circuitized substrate and it is ready for further processing.