The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 1978
Filed:
Jun. 28, 1977
Hitachi, Ltd., , JP;
Abstract
A mold die including two or more cavities shaped to profile the configuration of mold products, a pot serving as a lead-in portion for resin of a tablet-form, or a sprue serving as a lead-in portion for molten resin, a runner leading to the pot or sprue, and gates branching from the runner and leading to respective cavities, the aforesaid gates having given convergent slopes at their exits to the cavities. The cross-sectional area of the runner is progressively decreased in the direction away from the pot or sprue, and the convergent slopes of the gates are progressively increased in the direction away from the pot or sprue, in a manner that the sum of a pressure drop in a runner portion and a pressure drop in a gate portion may be made equal for each of the cavities, thereby minimizing a difference in timing of resin to arrive respective cavities, and rendering the velocity of resin flowing into respective cavities equal to one another.