The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 1978
Filed:
Sep. 06, 1977
Paul S Rumbaugh, Garden Grove, CA (US);
Altec Corporation, Anaheim, CA (US);
Abstract
A modular printed circuit board assembly has a plurality of printed circuit boards each of which is integrated with a separate heat sink to form a modular unit. Each such modular unit is removably supported in a housing on a separate pair of support tracks in the base and top cover of the housing, bottom edges of the printed circuit board and a runner formed on the edge of the heat sink riding in these tracks. Each of the heat sinks has a flange portion to which the associated printed circuit board is attached and on which elements such as power transistors which generate a substantial amount of heat are directly mounted. The main body portion of each heat sink has a plurality of fins in the form of longitudinal strips with longitudinal slots being formed between the fins. The printed circuit boards and their associated heat sinks joined together to form integral units are installed on the chassis in side-by-side relationship with the fins and slots in alignment with each other such that the slots of adjacent heat sinks form longitudinal channels. Continuous air circulation is provided through the channels thus formed by means of a blower which communicates with the ambient air and is positioned along the channels at one end of the stack of heat sinks and an outlet to the ambient air positioned along the channels at the other end of the heat sink stack, thereby affording a high flow of cooling air through the heat sinks.