The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 1978
Filed:
May. 24, 1976
Yoshitaka Momotari, Yokohama, JP;
Junji Hara, Kamakura, JP;
Tadashi Kitamura, Hiratsuka, JP;
Shigeo Iiyama, Yokohama, JP;
Mitsui Toatsu Chemicals, Inc., Tokyo, JP;
Abstract
Process for producing conductive cured products are disclosed. In one embodiment a copper compound is reacted with a reducing substance capable of reducing said copper compound to metallic copper, in the presence of a metallic copper powder on a substrate, thereby reducing the copper compound to metallic copper and forming a conductive connected unit of said metallic copper powder, and the connected unit is then subjected to cure molding with a resinous curable component to integrate the constituent elements into the conductive cured product. In a second embodiment, the ligand portion of a copper compound of a ligand capable of reducing copper in a compound state is reacted with the copper moiety present in said copper compound in the presence of a metallic copper powder on a substrate. The copper moiety is reduced and precipitated to form a conductive connected unit of a metallic copper powder and the connected unit is then subjected to cure molding with a resinous curable component.