The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 1978

Filed:

Jul. 17, 1973
Applicant:
Inventor:

Yuzaburo Sakamoto, Takasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
228-45 ; 228 45 ;
Abstract

An automatic bonding apparatus for assembling semiconductor devices, said apparatus comprising a bonding arm carrying a capillary at one end and mounted on a pedestal swingably in a vertical plane, said pedestal being mounted on a base movably in a horizontal plane, horizontal driving cam means for driving said pedestal in the horizontal plane, vertical driving cam means for effecting swinging movement of said bonding arm, and synchronizing mechanism for determining the speed ratio of said horizontal driving cam means to said vertical driving cam means.


Find Patent Forward Citations

Sakamoto, Yuzaburo. (1978). Automatic bonding apparatus for assembling semiconductor devices (U.S. Patent No. 4119259). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4119259

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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